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Cara Mencegah Noda pada Perak dan Menerapkan Pelapisan Perak Tanpa Listrik

Artikel ini membahas cara menjaga perhiasan perak tetap berkilau dan baru. Artikel ini menjelaskan berbagai cara untuk melindungi perak dari noda, seperti menggunakan bahan kimia atau pelapis khusus. Artikel ini juga membahas cara melapisi perak dengan logam lain dan cara memastikan lapisannya tetap berkilau. Sangat cocok bagi siapa pun yang membuat atau menjual perhiasan.

Cara Mencegah Noda pada Perak dan Menerapkan Pelapisan Perak Tanpa Listrik

Silver Plating and Anti-Tarnish Solutions for Jewelry

Pendahuluan:

This article explains how to prevent silver and silver-plated items from tarnishing, a common issue where surfaces darken due to reactions with sulfur or light. It details various anti-tarnish treatments, including inorganic methods like chromate or tin electrolysis, organic compound soaks, and surfactant applications. The text also covers what electroless silver plating is, exploring both displacement plating for substrates like copper circuits and reduction plating using agents like formaldehyde or hydrazine. Finally, it outlines why and how to analyze key components in cyanide silver plating solutions, such as silver ions and free cyanide.

cara mencegah noda perak dan menerapkan pelapisan perak tanpa listrik

Daftar Isi

Section I Silver Tarnish Prevention Treatment

Due to the high reactivity of the Ag plating surface, the silver-plated surface is prone to discoloration when in contact with corrosive media (such as H2S, SO2). Light also imparts excess energy to the plating surface, promoting the ionization of Ag and the reaction between Ag and the corrosive media.

Table 2-28 shows the effects of light wavelength and exposure time on the discoloration of Ag. Table 2-29 shows the effects of exposure time on color and chemical composition.

Table 2-28 Effect of Light Wavelength and Exposure Time on the Color Change of Ag
Ray Exposure time/h
6 12 18 24 48
2527Å No change in color Yellow spots Coklat kekuningan Brownish-black Coklat
3650Å No change in color No change in color No change in color Kuning -
Sunlight No change in color No change in color No change in color Yellow spots -
Table 2-29 Effect of Exposure Time on the Color and Chemical Composition of Silver-Plated Surface
2537Å Exposure color of light/h 6 12 18 24 48
Warna Perak Kuning Coklat kekuningan Brownish black Hitam
Main chemical composition Ag(metal) Ag2O+AgO Ag2O+AgO AgO+Ag (Superfine) Ag(Superfine)

From these results, it can be seen that the discoloration products are silver sulfides, oxides, chlorides, or silver particles. The color of the Ag plating after discoloration varies depending on the chemical composition. This type of color change not only affects the decorative appearance of the silver plating, but also increases the electrical resistance of the Ag plating, which is detrimental to the electrical properties of the silver plating.

From these discoloration mechanisms of the Ag plating layer, it can be seen that it is only necessary to avoid contact between the plating surface and oxygen, light, and corrosive media to prevent discoloration of the silver plating layer. At the same time, forming a dense substance (film layer) on the surface that can absorb ultraviolet rays should have an inhibitory effect on the discoloration of the plating layer.

Among the traditional methods for preventing discoloration of Ag plating layers are inorganic compound methods, organic compound methods, surfactant methods, and combined use of these methods.

1. Inorganic Compound Treatment Method

To compare the effects of different anti-tarnish treatments, the test pieces were plated with 2~3μm Ag and then soaked in a concentration of 0.2% ammonium polysulfide solution [(NH4)2SX] for a certain period. Visual inspection was used for evaluation. When visual inspection was impossible, a digital gloss meter was used to measure the specular reflectance, and the difference △ before and after soaking in the ammonium polysulfide solution was calculated. At the same time, for indoor exposure tests, a gloss meter was also used for measurement.

As an anti-tarnish treatment for Ag, metal films or metal oxide films with the same tone as Ag, such as In, Zn, Cd, Cr, Pd, Rh, Sn, Be, Al, Th and Zr, were tested. Among them, the electrolytic treatment of chromate exhibited the most outstanding anti-tarnish function and was widely applied. Secondly, Rh and Be are also among the choices.

   

(1) Precious Metal Treatment

Electroplating of Rh and Pd alloys was conducted under optimal conditions, followed by their tone changes and discoloration resistance experiments. The results are shown in Table 2-30. The specular reflectance of Rh is 70%, while the specular reflectance of the alloy (Pd80:Ni20) is about 57%. Although the plating thicknesses differ, there may be some correlation. The plating thickness of Rh is 0.1μm, and the plating thickness of Pd-Ni is 0.3μm. When the plating thickness of other metals on Ag increases, the silver color of the underlying silver layer disappears. However, by visually comparing tone, brightness, and relative values of specular reflectance, it was found that when the specular reflectance is 80%, the difference from the silver color becomes obvious, and 70% is its limit. Below this, the silver color disappears and changes to a different metal color. Therefore, from the tone perspective, a Rh plating thickness below 0.1μm is more suitable. Still, its discoloration resistance is insufficient, while the Pd-Ni alloy plating layer is thicker and has good discoloration resistance. Using precious metals means increased cost, but they offer good drug and wear resistance. The better the discoloration resistance, the more the original silver color disappears. Hence, enhancing discoloration resistance without changing the tone and brightness of the silver plating is very difficult.

  

(2) Treatment of Tin and Tin Alloys

Alloys of Cu and Sn are called mirror alloys. When the Sn content is above 60%, their color is silver-white, and the specular reflectance is also high, with good corrosion resistance. Therefore, they have been studied since ancient times and used as mirror surfaces in reflecting telescopes. When used as silver anti-tarnish coatings, they perform quite well against tarnishing for 5~6h. However, the specular reflectance drops to about 65%, clearly losing the silver color. The usability of mirror alloys depends on the degree of tint. Although cheaper than precious metals, when the film thickness increases to several thousand angstroms, a potential difference arises between the precious metal Ag and the Cu-Sn alloy, which may cause corrosion resistance issues.

Besides Sn alloy plating, Sn metal or Sn compounds precipitated by electrolytic or soaking treatments of 50~100Å can also have tarnish resistance and improved weather resistance. As a tarnish treatment, it can maintain the stability of the contact resistance of contacts for a long time.

The experimental results are shown in Table 2-30. Compared with alkaline and acidic solutions, parts treated with acidic solutions have a misty white precipitate and cannot be used for decorative purposes. In contrast, parts treated with alkaline solutions and electrolytic treatments show no problems in the short term.

Table 2-30 Inorganic Compounds Resistance to Discoloration on Silver-Plated Surfaces
Nomor seri Solution composition Processing conditions Condition to the occurrence of apparent color Catatan
1

PNP (Nissin Kasei, Japan)

Pd-Ni alloy plating

DK lA/dm2

Suhu ruangan

1min

Above 6h Loss of silver color, poor CN- resistance
2

Pewter(Daiya Shokai)

Cu-Sn alloy plating

3V

55℃

40s

Above 6h Loss of silver color
3

Na2Cu(CN)3 24g/L

Na2SnO3 90g/L

Free NaCN 16g/L

NaOH

Dk 2A/dm2

60℃

30s

Above 6h Loss of silver color, better than silver color of 1 and 2.
4

Na2SnO3 90g/L

CH3COONa 0g/L,5g/L,10g/L

DK 0. 5 A/dm2

Suhu ruangan

15〜90s

10 〜20s Adding CH3COONa can stabilize the solution, and the longer the electrolysis time, the more stable it is, but it will lose its silver color.
5

SnCl2 20 gram/L

0. 025NHCl 50mL/L

Suhu ruangan

1min

10min
6

SnCl2 20 gram/L

0.025NHCl 50mL/L

DK 0. 1 〜 2A/dm2

Room temperature, 10s

10min Putih

Room temperature ,1min, 10min

Slightly yellowed
7 Tin fluoroborate 3%

DK 0. 1 ~ 2 A/dm2

Room temperature , 10s

- Putih
Room temperature ,1min, 10min 10min Slightly yellow
8

Stannous sulfate 20g/L

Iodic acid 30mL/L

DK 0. 1 〜 2 A/dm2

Room temperature ,10s

- Putih
9

Stannous fluoroborate 20mL/L

Fluoric acid 30mL/L

Fluoroboric acid 20g/L

Room temperature ,1min, 10min

DK 0. 1 〜2 A/dm2

Room temperature ,10s

10min

-

Slightly yellowish

Putih

Room temperature, 1min, 10min 10min Slightly yellow
10

BeSO4 , 4H2O 2g/L

pH = 5. 7〜5. 8

DK 0. 007 A/dm2

Room temperature 3〜10min

Above 1h
11

BeSO4 , 4H2O 2g/L

pH = 5. 8

1 〜2. 4V

20s~4min

20min
12 EverShine S(Tamura Chemical)

6.5V

Suhu ruangan

90s

15min
13

K2CrO4 15 gram/L

NaOH 30g/L

2〜6V

Room temperature 15〜120s

10 〜30s The longer the electrolysis, the better
14

K2CrO4 30g/L

NaOH 40g/L

DK 4A/dm2

Room temperature 30〜40s

White fogging

No silver color

15

K2CrO4 30g/L

NaOH 40g/L

Heating 20h

White fogging

No silver color

16

Al2(SO)4)3 4 gram/L

Ammonium oxalate 2g/L

pH = 5. 8

DK 0.06A/dm2

Room temperature 30s〜1min

20 〜30s Same time as without treatment
17 Sodium carbonate
18

Na2SnO3 8. 5g/L

CH3COONa 5g/L

(No. 4)

DK 0,5A/dm2

15 〜30s

Suhu ruangan

Above 6h

K2CrO4 15 gram/L

KOH 30g/L

(No. 13)

2〜3V

30s

Suhu ruangan

19

K2CrO4 15 gram/L

KOH 30g/L

K2CO3 50 gram/L

6V

15 〜60s

10 〜30min
The soaking method utilizes the strong reducibility and strong adsorption of Sn ions. Except for the low concentration of chloride ions, all factors cause Ag to turn yellow, and it only has a certain degree of discoloration resistance, so it has not been used. Compared with soaking treatment, electrolytic treatment is more advantageous. Their common point is the low hardness of metallic Sn. The hardness of the electroplated thick film is Hv10~20. Although it has good resistance to sulfur and chemicals, its wear resistance is insufficient and easily scratched.

   

(3) Beryllium Treatment

Attaching a beryllium oxide film to Au, Cu and brass as a color-changing treatment can achieve good effect. The principle utilized by this method is: the isoelectric point of beryllium hydroxide is pH=5.8, and the following electrolytic reaction can occur:

Attaching a beryllium oxide film to Au, Cu and brass as a color-changing treatment can achieve good effect. The principle utilized by this method is: the isoelectric point of beryllium hydroxide is pH=5.8, and the following electrolytic reaction can occur
When the film thickens through this treatment, interference colors (neon colors) can be obtained, and it is more likely to appear in areas of high current density. Therefore, this treatment usually results in a patterned interference film. The hardness of this film is comparable to that of Sn; it is relatively soft but has better color fastness. The drawback of this method is the poor stability of the solution, and the high toxicity of beryllium makes it unusable.

   

(4) Aluminum Treatment

There are reports of oxide film formation similar to Be; additional experiments showed no difference between treated and untreated samples, and oxide film could not be formed.

   

(5) Chromate Treatment

Silver plating is the most common method for the anti-tarnish treatment of brass plating. There are two chromate treatment methods: cathodic electrolysis and soaking, but the cathodic electrolysis method is much superior.

Additives used in chromate electrolytes include: K2CO3, Na2CO3, KCN, NaS2O3, KCNS, NaCl, KI, EDTA, etc. Among them, the K2CO3 experimental results found that it can also act as a conductive salt, thereby shortening the electrolysis processing time compared to when it is not added. The effects of the other additives showed no significant differences.

The disadvantage of chromate electrolysis treatment is that the film has poor UV resistance and will turn brown after being left for a long time.

2. Treatment with Organic Compounds and Surfactants

Organic compounds were systematically classified, and their anti-discoloration effects were studied. At the same time, surfactants sold on the market were also tested. The experimental method used various experimental solutions, soaking under optimal conditions, washing with water, then soaking with untreated silver-plated samples in an 0.2% ammonium polysulfide solution for 3 minutes, and comparing and evaluating the degree of discoloration of the two types of samples. The results are shown in Tables 2-31 and 2-32.
Table 2-31 Anti-discoloration Experiment of Organic Compounds
Categorization Nomor seri Organic compounds Sifat Fisik Solubility Processing conditions Appearance Hydrophobicity Anti-discoloration effect
Aliphatic amine 1

Ethylamine (70% aqueous solution)

CH3CH2NH2

Mw 45. 09

d15 0. 6892

Melting point 83.3℃

Boiling point 16℃

(Aqueous) alcohols

Ether

0. 1mol/L (0. 65mL/L)

0. 01mol/L (6. 5mL/L)

Room temperature,20min,60min

pH 10〜11

Colorless Transparent

O

X X
2

Dodecylamine

CH2(CH2)11NH2

Mw 18. 5

Melting point 25℃

Boiling point 247℃

Acetone

(Ethanol)

0. 1mol/L (18. 5g/L)

Room temperature, 20min,60min

Colorless Transparent

Water stain

X X
3

Tributylamine

(CH3CH2CH2CH2)3N

Mw 185

d 0. 7782

Boiling point 216.5℃

(Ethanol)

Ether

0. 1mol/L (24mL/L)

Room temperature, 20min, 60min

Colorless Transparent

O

X X
Aromatic amines 4 O-Toluidine

Mw 107. 16

d20 0. 9989

Boiling point 199. 7℃

Water 1. 5(25)

(Ethanol)

Ether

0. 1mol/L (24mL/L)

Room temperature, 20min, 60min

Reddish brown transparent

O

X X
5 Diphenylamine

Mw 169.23

d 1.159

Boiling point 302℃

(Ethanol)

56

Ether

0. 1mol/L (17g/L)

Room temperature, 20min, 60min

Colorless transparent

Water stain

X X
Diamines, Polyamines 6 H2N(CH2)2NH2

Mw 45.09

d35 0.892

Melting point 8.5℃

Boiling point 117℃

(water)

Etanol

0.1mol/L (6. 7mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 10〜11

O

X X
Diamine, polyamine 7

Diethylenetriamine

H2 N(CH2 )2 NH(CH2 )2 NH2

Mw 103

Boiling point 208℃

(water)

Etanol

0. 1mol/L (10mL/L)

Room temperature, 20min,60min

Colorless Transparent

pH 10〜11

O

X X
8

Trietilen tetramina

H2 N(CH2 )2 NH(CH2 )2

NH2 (CH2 )2 NH2

Mw 146

Melting point 208℃

Boiling point 174℃

(water)

0.1mol/L (15mL/L)

Room temperature, 20min,60min

Colorless Transparent

pH 10〜11

O

X X
Amino alcohols 9

Trietilen tetramina

H2N(CH2)2NH(CH2)2

NH(CH2)2NH2

Mw 189 (water)

0. 1mol/L (19mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 10〜11

O

X X
10

Ethanolamine

HO(CH2)2NH2

Mw 61.09

d27 1.0111

Boiling point 171℃

(water)

Etanol

0. 01mol/L (0.61mL/L)

0.1mol/L (6.1mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 9〜10

O

X X
11

Diethanolamine

(HOCH2CH2)2NH

Mw 105.14

d20 1.0916

Melting point 28℃

Boiling point 268℃

(water)

Etanol

0. 01mol/L (0.96mL/L)

0.1mol/L (9.6mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 9〜10

O

O X
12

Triethanolamine

(HOCH2CH2)3NH

Mw 149.19

d20 1.124

Melting point 21.2℃

Boiling point 227℃

(water)

Etanol

0. 01mol/L (1.3mL/L)

0.1mol/L (13mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 9〜10

O

O X
13

2N-Diethylamine

(CH2)2NCH2CH2OH

Mw 93.1

Boiling point 39.5℃

(water)

0. 1mol/L (0.89mL/L)

0. 01mol/L (8.9mL/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 9〜10

O

O X
14 2-Amino-2-ethyl-1,3-propanediol Mw 105 (water)

0.01mol/L (1.1g/L)

0. 1mol/L (11g/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 9〜10

O

O X
Amide 15 Acetamide

Mw 59.07

d 1.159

Melting point 52.62℃

Boiling point 221℃

(water)

Etanol

0. 1mol/L(5.1mL/L)

Room temperature, 20min, 60min

Colorless Transparent

O

X
16 Acrylamide

Mw 71.1

d 1.122

Melting point 85℃

(water)

Etanol

Ether

Trichloromethane

0. 1mol/L(7.1mL/L)

Room temperature, 20min, 60min

Colorless Transparent

O

X
17 Benzylamine

Mw 121.14

d 1.341

Melting point 128℃

Boiling point 290℃

(water)

Etanol

0. 1mol/L(12g/L)

30℃

Room temperature, 20min, 60min

Colorless Transparent

O

O X
Oxime 18 Butanedione oxime

Mw116.12

Melting point 240℃

(Ethanol)

Ether

(Water)

0. 01mol/L (0.12g/L)

0. 001mol/L (1.2gmL/L)

Room temperature, 20min, 60min

Colorless Transparent

O

X X
19 Benzohydrin oxime

Mw227

Melting point 154℃

(Ethanol)

(Ammonia)

0.01mol/L (0.23g/L)

0. 001mol/L (2.3g/L)

Room temperature, 20min, 60min

Colorless Transparent

X X
Pyridine 20 Pyridine

Mw 79.10

d20 0.977

Boiling point 115.5℃

(water)

Etanol

0. 001mol/L (0.1mL/L)

0.1mol/L (8mL/L)

Room temperature, 20min, 60min

Colorless Transparent

O

X X
Quinoline 21 Quinoline

Mw 127.16

d20 0.938

Melting point -15℃

Boiling point 238℃

Hot water, dilute acid, ethanol, ether, carbon disulfide (6mol/L HCl)

2~20mol/L

0.1% (1g/L)

1% (10g/L)

Room temperature, 20min, 60min

Colorless Transparent

pH 2~4

O

O X
22 Carboxyquinoline

Mw 145

Melting point 75~76℃

Ethanol, acetone, trichloromethane, benzene (6mol/L HCl)

2~20mol/L

0.1% (1g/L)

1% (10g/L)

Room temperature, 20min, 60min

Yellow Transparent

pH 2~4

O

X X
Quinoline 23 Butanedione oxime Mw 256

Inorganic acid (6mol/L HCl)

40mol/L

Etanol

0.1% (1g/L)

1% (10g/L)

Room temperature, 20min, 60min

Yellow Transparent

pH 10~11

O

X X
Diazo compounds 24 p-Ethoxy-2,4-diaminoazobenzene Mw 256

Inorganic acid (6mol/L HCl)

40mol/L

Etanol

0.1% (1g/L)

1% (10g/L)

Room temperature, 20min, 60min

Red Transparent

O

O X
Hydroxycarboxylic acid 25 Tannic acid Yellowish white, light color, powder

(water)

Etanol

Acetone

0.1%

0.1%

5%

Colorless Transparent pH 6

Yellow transparent pH 4

Yellowish brown transparent pH 2

X X
Thiourea 26 1-Acetyl-2-thiourea

Mw 118.16

Melting point 165℃

(water)

Alcohol

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 7

O

O X
Thiourea 27 Aminothioureas

Mw 95.6

Melting point 81~183℃

(6mol/L HCl)

50mL/L

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 1

O

X X
28 Dithizone Mw 256

(Trichloromethane)

Karbon tetraklorida

10 gram/L

Room temperature, 20min, 60min

Blue water stain

Turns yellow

O X
Monosaccharide 29 Ascorbic acid (vitamin C)

Mw 176

Melting point 190~192℃

(water)

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 1

O

X X
Imidazoles 30 1-Acetyl-2-thiourea

Mw 155

Decomposition 287~288℃

Methanol

Water 45mL

1g/L, 10g/L

Room temperature, 20min, 60min

Colorless Transparent

pH 1

O

X X
31 2-Heptadecylimidazole

Methanol 55mL

Water 45mL

Dissolution

Alcohol, acid

1g/L, 10g/L

Room temperature, 20min, 60min

White suspension

Uneven

White adherence

O O
Benzimidazoles 32 2-mercaptopyridine

Mw 150

Melting point 301~302℃

Methanol 15mL

Water 45mL

Hot water

Etanol

NaOH

1g/L, 10g/L

Room temperature, 60℃

20min, 60min

Colorless transparent

O

O X
Triazoles 33 3-Amino-1,2,3-triazole

Mw 159

Melting point 159℃

(water)

Etanol

Trichloromethane

Room temperature, 60℃

1min, 10min, 60min

O - X
Benzotriazole 34 Benzotriazole

Mw 119.13

Melting point 99℃

Hot water

Alcohol

12g/L, pH 6

60℃

1min, 3min, 10min

Colorless Transparent

O

- X
Triazine 35 Triethylenediamine

Mw 140

Sublimation above 230°C

(water)

Hydrate

(CN2)2N

Trichloromethane

Alcohol

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 8

O

X X
Oxazole 36 2-Oxobenzazole

Mw 1151

Melting point 143.2℃

Amonia

6mol/L ammonia

200mL/L

Acetic acid

Ether

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 10

O

O X
(Oxo)zines 37 Morpholine

Mw 87.12

d13 1.0007

Boiling point 128℃

(water)

Alcohol

Ether

10 gram/L

Room temperature, 20min, 60min

Colorless Transparent

pH 9~10

O

X X
Thiazole 38 Ortanin

Mw 264

Melting point 200~246℃

(Decomposition)

Red needle-like crystals

Strong acids

Dense

Trichloromethane

Ether

Benzene (acetone)

1g/L

Room temperature, 20min, 60min

Red transparent

(Red precipitate)

Brown water stain

O X
Benzothiazole 39 Benzothiazole

Mw 135.39

d12 1.2349

Boiling point 231℃

(Ethanol)

Ethyl ether

1g/L

Room temperature, 3min, 60min

Reddish brown

Transparan

O

X
40 2-Hydrophobic benzothiazole

Mw 167

Melting point 177℃

Etanol

Ethyl ether

Benzene

Acetic acid

Potassium carbonate

Potassium hydroxide

Sodium hydroxide 2g/L

1g/L

Room temperature, 3min, 60min

White turbid

pH 10

O

X O
Naphthalenes 41 Naphthalene sparing agent

Mw 217

Melting point 109.5℃

Water (20℃)

0.01g/L

0.2g/L (Precipitation)

Room temperature, 2min, 10min, 30min

O - X
Isoacetone

10 gram/L

Room temperature, 10min, 60min

Yellow transparent

Water stain

O O

Isoacetone

50%

Water 50%

5 gram/L

Room temperature, 10min, 60min

Yellow transparent

Water stain

O O
Table 2-32 Surfactants’ Anti-Discoloration Experiment
Nomor seri Name (company name) Status Concentration Processing conditions Appearance Hydrophobicity Inhibition effect Keterangan
1 Rust Preventive Agent MC- 501 (Japan Lion Grease)

Light red transparent, d 1.06

pH 8. 0〜8. 5

2%,10% Room temperature 20min, 60min O O Ag:x
2% Room temperature 15s, 10min O O Cu:Tap water immersion X, exposure test △ 15s better
2 Enajiko-ru CNS (Japan Lion Grease)

Amphoteric

pH 8〜9

1% Room temperature 20min, 60 min (Ag)15s, 10min(Cu) O O Ag:x Cu:Tap water immersion X, exposure test: 1% 15s good

15% Sodium benzene sulfonate

15% (Neutral)

Room temperature 20min,60min (Ag)15s, 10min(Cu) Brown, white precipitate adhesion O

10% Potassium pyrophosphate

5% (Alkaline)

Room temperature 20min,60min (Ag) 15s, 10min(Cu)

White turbidity

O

O
3 Ripa-ru OH- 104P (Japan Lion grease) 0.1% Room temperature 20min,60min

Colorless and transparent

O

Yellowish-white turbid

O

O

Ag:x
1%
10%
4 Dyuomin CD (Japan Lion Grease) 0.1% Room temperature 20min,60min

White cloudy

O

Yellow muddy streaks

O

O Ag:x
1%
10%
5 Dyuomin CDA-50 (Lion Grease, Japan) 0.1% Room temperature 20min,60min

Colorless and transparent

O

O

Ag:x Slightly better at 60min
1%
10%

Turbid yellow

O

6 FC-98 (Kanto Chemical, Japan) Anionic white powder containing fluorine

0.1%

1%

Room temperature 20min,60min

Colorless and transparent

pH 5~7

Mottled marks

O ×(Ag)
7 FC-134 (Kanto Chemical, Japan) Fluoride-containing oxygen ion tea-brown powder

0.1%

1%

(Ethanol)

Room temperature 20min, 60min

5min, 30s

Yellow transparent, Transparent yellowish-brown

pH 6

Mottled marks

O ○(Ag) Marks disappear when temperature is lowered
8 Soft-data-jento W (Japan Lion grease) Cationic White powder 1% Room temperature 20min

White turbid

pH 7

O

X X

OH

RCH2CH(CH2)nSO3Na

(MIX)

α-Allylsulfonate

9 Ripomin COH (Japan Lion Grease) Amphoteric liquid 1% Room temperature 20min

White turbid

pH 8

O

O X Imidazolyl
10 Perettex TR (Kao, Japan)

Cationic

Colorless transparent

1% Room temperature 20min

White turbid

pH 10

O

O X

RODC—CH—SO3N4R—OOC—CH3

Sodium dipropylsulfosuccinate

11 Ema-ru 20C (Kao, Japan)

Cationic

Light yellow liquid

1% Room temperature 20min

Colorless turbidity

pH 7

O

X X

R—O(CH2 OH)nSO3Na

Polyoxyethylene alkyl acids

12 Koutamin 24P (Kao, Japan)

Anionic

White solid

1%

Colorless and transparent

pH 7

O

O X Trimethylamine
13 Perettex # 1222 (Kao, Japan) Nonionic 1% Room temperature 20min

White cloudy

O

O X
14 Perettex # 1265 (Kao, Japan) Nonionic 1% Room temperature 20min

Colorless and transparent

O

O X
15 Soft-kurin QA-1 (Miyoshi, Japan)

Amphoteric

White Solid

1% Room temperature 20min

Colorless turbidity

pH 7

O

O X β-alanine type
16 Soft-kurin MA-3-70 (Miyoshi, Japan) Amphoteric 1% Room temperature 20min

Colorless and transparent

pH 8

O

O X
17 Marusenokku AgT (Japan Ma-ruseru) Silver anti-tarnish agent

3mL/L

30mL/L

Room temperature 30s, 60min

White cloudy

pH 8

Adhesion

O Refer to the instruction manual
18 Dainshiruba-SS (Yamato Kasei, Japan) Silver anti-tarnish agent

10% Isopropyl

Ketone 50%

Water 10%

25~30℃

4min, 20min, 60min

Colorless and transparent

pH 8

O

O X Refer to the instruction manual
19 T611 (Uemura Kogyo, Japan) Silver anti-tarnish agent

Liquid 10%

90%

Room temperature 30s, 2min, 10min, 60min Colorless transparent spots O O Refer to the instruction manual
20 Roukorinsu- eido (Aikorouko, Japan) Silver anti-tarnish agent 1% Room temperature 31min, 5min, 30min

White cloudy

pH 7

O

O X For use in electronic factories

Among organic compounds, those with an anti-Ag discoloration effect when soaked in 0.2% ammonium polysulfide solution are 2-17 alkanimidazole, 2-mercaptobenzimidazole, and complexing agents.

Organic compounds with these anti-discoloration effects share the following characteristics:

① Treatment is carried out in an alkaline region near pH 7.

② Contains hydrophobic groups (long-chain alkyl, phenyl).

③ Contains dimethylamine groups or —SH groups or contains double bonds.

④ Insoluble in water.

⑤ Colorless, close to solid.

However, some cases meet the above conditions but do not have anti-discoloration effects, such as 2-mercapto benzimidazole and 2-thiazolyl benzimidazole.
The mutual relationship between them is still not very clear.

The effects of FC-134 and T611 have been confirmed regarding the anti-discoloration effect of surfactants. At the same time, experiments were conducted on the combined effect of organic compounds and surfactants (FC-134), and no significant effect was found (Table 2-33). The discoloration resistance of 0.2% polysulfide ammonium solution lasts only about 10 minutes at most. Meanwhile, the solvent (diluent) resistance is also relatively weak. For discoloration resistance of decorative items due to the presence of stains, considering these issues comprehensively, the only possible usage is 2-mercapto benzimidazole with FC-134 (see Table 2-34).

Table 2-33 Combined Effects of Organic Compounds and Surfactants on the Anti-Discoloration of Silver-Plated Layers
Nomor seri Komposisi Processing conditions Appearance Hydrophobicity Anti-color change property Keterangan
1

2-Heptadecamidazolelg/L

FC-134 1g/L

EtOH : H2O = 1 :1

Suhu ruangan

1min, 60min

White precipitate pH7 Adhesion O

O

Less effective than when used alone

2

2-Mercaptobenzimidazole 1g/L

FC-134 1g/L

NaOH 2g/L

Suhu ruangan

1min, 60min

O X

O

Better than when used alone

Reduced foaming power, the longer the better
3

Mercaptone 5g/L

FC-134 0. 5g/L

Isoacetone:H2O = 1 :1

Suhu ruangan

1min, 60min

O

O

Better than when used alone

Reduced foaming power, the longer the better
Table 2-34 Effect of Solvents on Anti-Discoloration Film
Organic compounds Processing conditions Solvent Appearance Anti-discoloration effect
2-Heptadecamidazole

1g/L

(C2H5OH : HO = 1 : 1)

20min

Stains O

Diluent

(5min)

Stain disappears

O

X

Alcohol

(5 min)

Stain disappears

O

X
Coarse spray Scratch

O

Only the scratched part is discolored

2-Mercaptobenzimidazole

10 gram/L

NaOH 2g/L

Room temperature 20min

O O

Thinner

(5min)

O X

Alcohol

(5min)

O
Coarse spray Scratch

O

Only the scratched part is discolored

The above experimental results are summarized as follows.

① It is difficult to ensure that Ag’s unique tone and luster are not damaged when applying other precious metals on Ag for anti-tarnish treatment.

② Using Sn or Sn alloy methods, when the thickness of Sn is 50~10Å, the anti-tarnish effect can be achieved, but the effect of this method alone is limited.

③ Treatments with Be and Al have little effect.

④ Classical treatments like chromate treatments have relatively good effects. However, their biggest drawback is that the treated film has weak UV resistance and may turn brown over long-term protection.

⑤ Among organic compounds, those with anti-discoloration properties include 2-heptadecylimidazole, 2-alkyl benzimidazole, and mercapto naphthalene agents. However, other organic compounds with the same structure do not necessarily have the same anti-discoloration ability.

⑥ The effectiveness of FC-134 in surfactants sold on the market has been confirmed.

3. Anti-Discoloration Effect of Combined Treatment with Tin Electrolysis and Chromic Acid Electrolysis

From the above results, although various anti-discoloration treatment methods have been studied, no optimal solution has been found. However, tin plating treatment has shown some relative effectiveness. Some explanations on the tin electrolysis treatment and chromic acid electrolysis treatment experiments will be provided next.

   

(1) Discoloration Promotion Test and its Discoloration Measurement Method

The conditions for the discoloration promotion test are shown in Table 2-35.

Table 2-35 Conditions for Anti-Discoloration Promotion Test
Larutan

Ammonium sulfide solution (yellow) (Showa Chemical)

(NH4)2Sx(2%)

Suhu 20℃
Soaking time 2h
Methods for measuring discoloration include visual inspection, weighing, optical methods, and contact resistance measurement. However, from a usage perspective, the reflectance (measuring angle 60°)before and after the discoloration test was measured by visual inspection and gloss meter method (same as an inorganic compound treatment method) at a measurement angle, and the change amount △ was calculated using the formula (2-1). The smaller the value △, the more difficult the discoloration, meaning better sulfur resistance.

△(%) = L– L2                 (2-1)

In the formula, 

L1— reflectance before the color change test, %;

L2— reflectance before the color change test, %.

   

(2) Tin Electrolyte

Through experiments on the effects of treatment conditions of the tin electrolyte, it was determined that the concentration of sodium stannate, electrolysis time, current density, and treatment temperature could be ignored regarding their impact on the discoloration resistance characteristics. At the same time, sodium acetate was added as a stabilizer in the alkaline Sn plating. The composition and optimal conditions for Sn electrolysis are shown in Table 2-36.

Table 2-36 Composition and Optimal Conditions for Sn Electrolysis
Composition of plating solution

NaSnO3 • 3H2O 8. 5g/L

CH3COONa ・ 3H2O 5g/L

Treatment conditions

Current density 0. 5A/dm2

Electrolysis time 15s (10〜30s)

Temperature 20℃ (7〜30℃)

Anode material Stainless steel plate

   

(3) Relationship Between Emissivity and Electrolysis Time

The relationship between reflectivity and electrolysis time is shown in Figure 2-8. As the electrolysis time increases, the reflectivity decreases sharply, which detracts from the hue of Ag. An electrolysis time of about 90 seconds will show a tin-white color, and at about 180 seconds of electrolysis, light brown streaks appear on the surface. At the same time, when the electrolysis time exceeds 60 seconds, the electrical properties also deteriorate. The experimental results obtained according to equation (2-1) are shown in Figure 2-9. As the electrolysis time increases, the △ value decreases.

Figure 2-8 Relationship between reflectivity and electrolysis time

Figure 2-8 Relationship between reflectivity and electrolysis time

Figure 2-9 Electrolysis Time and Discoloration Resistance

Figure 2-9 Electrolysis Time and Discoloration Resistance

   

(4) Electrolytic Tin Film Thickness and Electrolysis

Considering the cathode current efficiency according to Faraday’s law, the relationship between electrolysis time and film thickness is shown in Figure 2-10. The tin thickness is about several tens of angstroms.

Figure 2-10 Relationship between Electrolysis Time and Film Thickness
Figure 2-10 Relationship between Electrolysis Time and Film Thickness

   

(5) The Influence of Impurities

The effects of possible impurities (CN, Ag, Cu, Ni, etc.) that may be mixed into the electrolyte in Table 2-36 on the appearance and sulfide resistance of the electrolytic membrane were confirmed through experiments. The results are shown in Table 2-37.

Table 2-37 Effect of Impurities on Sulfur Resistanc
Impurities Concentration/×10-6 Electrolysis Time /s
30 60 120
Tidak ada 0 O O △(white)
CN

20

200

2000

20000

O

O

O

△,white

O

△,white

△,white

△,white

△,white

△,white

△,white

△,white

Ag

20

50

100

150

200

400

O

O

X

X

X

O

△,red

X, red-black

X,red-black

X,red-black

X, black

△,red

△,red-black

X, red-black

X, red-black

X, black

X, black

Cu

20

200

300

400

500

600

1000

O

O

O

△,red

△,red

x,red

x,red

O

O

△,white

△,red

X,red

X,red

X,red

△,white

△,white

△,red

△,red

X,red

X,red

X,red

Ni

20

200

1000

O

O

O

O

O

O

O

O

O

Note: 1. Compounds used: CN—NaCN;Ag—KAg(CN)2;Cu—KCu(CN)2; Ni—Ni (CN)2 • 2KCN - 2H2O.

2. Degree of color change: ○ no appearance change; △ slight color change; × color change.

From the appearance of the membrane after electrolysis, the allowable concentrations of various impurities are as follows: Ag 50X10-6, Cu 300X10-6. The presence of CN and Ni is not problematic, but their sulfur resistance will be affected.

   

(6) Chromate Electrolysis

Besides chromate, inorganic salts in the electrolyte, such as (Na2CO2, KCN, KI, Na2S2O3, etc.), are used as additives. These aqueous solutions have long been reported as anti-tarnish agents for silver. The basic composition of the electrolyte is shown in Table 2-38.

Table 2-38 Cr Electrolytic Process Conditions
Electrolyte Composition

K2 CrO4 15 gram/L

NaOH 30g/L

Used after 30h heating and maturing process
Treatment Conditions

Voltage 6V (2 〜 6V)

Electrolysis time 15s (60s)

Temperature 20℃

Anode material Stainless steel plate

   

(7) The Relationship between Reflectivity and Electrolysis Time

The relationship between reflectivity at a voltage of 2~6V and electrolysis time is shown in Figure 2-11. As the voltage increases, the thickness of the Cr film increases while the reflectivity decreases. Unlike the case with Sn electrolyte, under the same voltage conditions, the increase in electrolysis time does not affect reflectivity.
7. The Relationship between Reflectivity and Electrolysis Time
The relationship between reflectivity at a voltage of 2~6V and electrolysis time is shown in Figure 2-11. As the voltage increases, the thickness of the Cr film increases while the reflectivity decreases. Unlike the case with Sn electrolyte, under the same voltage conditions, the increase in electrolysis time does not affect reflectivity.

Figure 2-11 Relationship between reflectivity and electrolysis time (Cr electrolyte)
Figure 2-11 Relationship between reflectivity and electrolysis time (Cr electrolyte)

   

(8) Sulfide Resistance

The comparison △ results under the condition of soaking in 0.2% (NH4)2Sx solution for 2 hours are shown in Figure 2-12. The higher the voltage, the better the sulfur resistance, mainly due to the thickening of the chromium oxide film. If the electrolysis time is prolonged without improvement, it is because there are too many pinholes in the electrolytic film, resulting in an increase in chromic acid mixed into the pinholes.

Figure 2-12 Relationship between reflectivity and electrolysis time (Cr electrolysis solution)
Figure 2-12 Relationship between reflectivity and electrolysis time (Cr electrolysis solution)

   

(9) Discoloration Caused by ultraviolet light

The discoloration and sulfur resistance results of Cr electroplated films caused by ultraviolet irradiation are shown in Table 2-39 (Cr electroplating conditions: 6V, 30s). After ultraviolet irradiation, the Cr electroplated film is completely damaged, turning reddish-purple and bluish-purple. At the same time, the sulfur resistance also sharply decreases, dropping to the same level as without anti-discoloration treatment. There is little difference between the anti-discoloration-treated samples and those exposed to sunlight due to the difference in ultraviolet intensity compared to general ultraviolet irradiation experiments.

Table 2-39 Color Change Caused by Ultraviolet Irradiation
Nomor seri Ultraviolet L1/% L2/% L3/% 1/% 2/% Keterangan
1 - - 86. 3 - 84. 8 0 1.5 (Turns yellow)

2

3

4

UV

0.5

1

3

86. 0

86. 2

86. 5

86. 0

83. 2

58〜65

67

53

0

3

21〜28

19

33

Biru

-

Violet

5

6

Sunlight

3

6

86.6

86.4

86.6

86.4

85.6

85.5

0

0

0.8

0.9

(Turns yellow)

-

① The photoelectric gloss meter uses a hydrogen discharge tube.

② Outdoor exposure during the daytime:

L1 —— Reflectance before irradiation;

L2 —— Reflectance after irradiation;

L3 —— Reflectance after soaking in 0. 2% (NH4 )2 Sx for 30 minutes following irradiation.

1 =L1 - L2

2 =L1 - L3

   

(10) The Impact of Impurities

The test results of impurity effects in the basic composition are shown in Table 2-40.

Table 2-40 Effects of Impurities
Impurities Concentration /×10-6 Appearance
CN

200

400

600

800

1000

O

O

O

O

O

Ag

10

20

30

40

50

O

O

O

X(black)

X(black)

Sn

200

400

600

800

1000

O

O

O

O

O

The presence of CN and Sn mixed in does not affect the appearance. When the Ag content is 40×10-6, black spots may appear, but there is no adverse effect on sulfur resistance.

   

(11) Sn Electrolysis Treatment Plus Cr Sulfur Resistance during Electrolytic Treatment

The methods introduced above each have pros and cons and cannot be considered complete anti-discoloration methods. Therefore, the following approach is considered: immediately performing electrolytic Sn treatment after plating Ag, followed by electrolytic Cr treatment.

Under constant current conditions ( DK = 0. 5A/dm2 ), the electrolysis time of Sn was changed, and during the subsequent Cr electrolysis treatment, its voltage and electrolysis time were varied. The results are shown in Figure 2-13. The reflectivity reduction under each condition is caused by changes in Sn electrolysis time. The electrolysis time must be kept within 30 seconds to maintain the silver tone.

Figure 2-13 Relationship between reflectivity and electrolysis time
Figure 2-13 Relationship between reflectivity and electrolysis time

When in the same Sn electrolysis treatment time state, extending the Cr electrolysis time causes the color of the Cr underlying Sn to show through, resulting in a white or gray uneven state. At the same time, when Cr electrolysis is at a high voltage (6V), this phenomenon appears earlier; at 6V, it can be seen in 5 seconds, whereas at 2V, it can last more than 60 seconds. The extension of Sn electrolysis time shows the same tendency. The longer the electrolysis time, the more likely whitening occurs.

This phenomenon appears when the charge passed during the Cr treatment of a certain Sn electroplated layer reaches a certain value. The redox reaction during Cr electroplating plays a certain role on the Sn electroplated layer, causing changes in the crystallization morphology of Sn or causing changes in the contrast between the Sn electroplated layer and the Cr electroplated layer.

Soaking in 0.2% (NH4)2Sx solution for 2 hours, the △ value obtained through equation (2-1) is shown in Figure 2-14. It is lower than when Sn electroplating and Cr electroplating are performed separately (close to 0), and it also has good sulfur resistance. After soaking in 0.2% (NH4)2Sx solution for 2 hours, no discoloration occurs.
Figure 2-14 Sulfur resistance (SGP)
Figure 2-14 Sulfur resistance (SGP)

When no color change occurs, it is related to the extension of Sn electrolysis time. The electrolysis time is 15~30s+ electrolysis time over 30 seconds especially has good sulfur resistance, but there will be appearance issues. The combination of Sn electrolysis at 0.5A/dm2 for 15~30s, plus Cr electrolysis at 2~3V for 30s was the optimal condition.

The results of the indoor exposure test are shown in Figure 2-15. Yellowing after 1~2d for untreated and 7~10d for Cr electrolytic treatment. In contrast, the parts treated with Sn electrolysis followed by Cr electrolysis only began to partially turn gray after 60~100d, showing good effectiveness. Soaking was conducted using a 0.2% (NH4)2Sx solution equivalent to one month of indoor exposure testing. The Sn electrolysis treatment followed by the Cr treatment is abbreviated as SGP (silver guard process).

Figure 2-15 Indoor Exposure Test
Figure 2-15 Indoor Exposure Test


① The effect of various tin salts on sulfur resistance 

The test results of the effects of various tin salt surface activators in the SGP method are shown in Table 2-41 and Figure 2-16.

Table 2-41 Comparison of the Effects of Various Tin Salts
Nomor seri Komposisi dan kondisi prosesnya Sn electrolysis time /s Cr Electrolysis time/s L1/% △/% Keterangan
1

SnCl2 4 gram/L

HCl 0.025mol/L

(immersion)

13

30

60

15

90. 2

89. 8

89. 2

5. 4

4. 8

5. 8

Yellowing

Yellowing

Yellowing

2

Na2SnO3 ·3H2O 8. 5g/L

CH3COONa·3H2O 5g/L

3. 5V(0. 1A/dm2)

15

30

60

15

89. 7

87. 3

85. 2

0. 7

0. 1

0

Partial yellowing

-

Tin color

3

No. 2 plus Peretekkusu#

1232 0. 1g/L

3. 5V (0. 15A/dm2)

15

30

60

15

87. 4

85.0

76. 6

0

0. 1

0

-

-

Tin color

4

K2SnO3·3H2O 8. 5g/L

CH3COONa·3H2O 5g/L

3. 5V (0. 1A/dm2)

15

30

60

15

89. 6

88. 9

85. 4

0. 9

0

0

Partial yellowing

-

Tin color

① Peretekkusu# 1232 is a product of Miyoshi Oil & Fat in Japan.

Note: Cr electrolyte 3 V.

Figure 2-16 Comparison with other Sn salts
Figure 2-16 Comparison with other Sn salts
The results of sulfur resistance are shown in Figure 2-17. When the soaking time in the stannous chloride electrolyte (No. 1) is extended, unlike the sodium stannate electrolyte, it does not cause a decrease in reflectivity. The sulfur resistance is also independent of soaking time, maintaining a certain △ value (electrolysis from this electrolyte results in a whitened product, which detracts from the appearance). This is due to the adsorption of Ag-Cl-Sn reaching equilibrium.
Figure 2-17 Comparison of sulfur resistance with other Sn salts
Figure 2-17 Comparison of sulfur resistance with other Sn salts

Adding a non-ionic surfactant (No. 3) to the sodium stannate electrolyte significantly improves current efficiency, accelerates the electrolysis rate (No. 2), reduces reflectivity, and enhances sulfur resistance.

Although the results of the potassium stannate electrolyte (No. 4) are the same as those of the sodium stannate electrolyte, there are certain differences between the effects of sodium salts and potassium salts in alkaline tin plating solutions.



② The effect of chromium electrolyte on sulfur resistance was mainly studied from aspects such as electrolyte concentration, the effect of surfactants, and the influence of current density on the appearance after treatment.

Table 2-42 Effect of Concentration on Sulfur Resistance
Concentration /(g/L) Electrolysis time /s Current value at constant voltage (6V)/A
5 15 30

K2CrO4 15

NaOH 30

X X X

4. 0

(40A/dm2)

K2CrO4 7.5

NaOH 15

O X X

2.4

(24A/dm2)

K2CrO4 1.5

NaOH 3.0

O O X

0.6

(6A/dm2)

Note: O indicates no change in appearance;

× indicates a change in appearance (whitening).

  • Effect of concentration: The standard solution was diluted to 1/2, 1/10, and the electrolysis time at which a tin color appeared during electrolysis at 6 V was investigated. The results are shown in Table 2-42.

  • Effect of Surfactants: Standard solutions of surfactant (Perettekusu#1265, a product of Miyo-shi Oils and Fats Co., Ltd., Japan) were added with ionic surfactant at concentrations of 1/1 and 1/2, and the electrolysis time was investigated at the time when it began to show a tin color. The results are shown in Table 2-43. Compared to no addition, the effect was better at high current density when surfactants were added. At low current density, there was little difference from the case without addition, but gas hindered the progress of electrolysis. When surfactants were present, their concentration and current density affected the time for whitening to start, increasing management difficulties. At the same time, bubbles were produced due to the large amount of hydrogen generation. It was easier to manage without addition.

Table 2-43 Effects of Surfactants
Concentration/(g/L) Perettekusu# 1265/(mL/L) Voltage/V DK/(A/dm2 Electrolysis Time/s
5 10 15

K2CrO4 15

NaOH 30

0

6

5

6

3

40

29

19

7

X

X

X

X

X

X

X

X

X

X

X

X

0.01

6

5

6

3

40

29

19

7

O

O

O

O

X

X

O

O

X

X

X

X

0.1

6

5

6

3

40

29

19

7

O

O

O

O

O

O

O

X

X

X

X

X

1 6 40 O X X

K2CrO4 7.5

NaOH 15

0

6

5

6

3

24

17

10

3

X

X

X

O

X

X

X

O

X

X

X

X

0.01

6

5

6

3

24

17

10

3

O

O

O

O

O

O

X

X

X

X

X

X

  • Influence of Current: Density The time when the tin color first appears at various current densities during electrolysis is shown in Figure 2-18. At the same time, the E-I curve is shown in Figure 2-19. The current density is more appropriate when the electrolysis time is 0.5A/dm2 around 30 seconds. Meanwhile, the time without the appearance of tin color is also affected by electrolyte concentration, anode current density, electrode spacing, and other factors. Concentration management is done by calculating the size of the tank, and it is possible to derive the intrinsic power of the tank that does not appear tin-colored at a certain voltage, for ease of management.

Figure 2-18 Relationship between current density and electrolysis time

Figure 2-18 Relationship between current density and electrolysis time

Figure 2-19 E-I curve of the electrolyte solution

Figure 2-19 E-I curve of the electrolyte solution

The anti-tarnish management of Ag is diverse. Compared with other methods, the SGP method does not damage the color of Ag and has sulfur resistance. The process is shown in Figure 2-20. The sulfur resistance results of this process are shown in Figure 2-21.
Figure 2-20 Chromium Electrolyte Treatment Process

Figure 2-20 Chromium Electrolyte Treatment Process

Figure 2-21 Comparison of Sulfur Resistance of Various Treatment Methods

Figure 2-21 Comparison of Sulfur Resistance of Various Treatment Methods

At the same time, using detergents (surfactants) containing α-diketone and its salts to wash or soak silver (or silver-plated items) and its alloys (tin alloy, zinc alloy, indium alloy, palladium alloy, etc.) can greatly inhibit surface discoloration or corrosion.

The basic structure of its additive is shown in Figure 2-22.

Figure 2-22 Basic structure of silver and its alloy anti-tarnish agent molecules
Figure 2-22 Basic structure of silver and its alloy anti-tarnish agent molecules
Where X1 is an oxygen or nitrogen atom, X2 is a carbon or oxygen atom; when X1 is oxygen, Y1 does not exist) C1~C12 is an alkyl group; Y2~Y10 is H, OH, or an alkyl group of C1~C12 (where halogen atoms or OH can also substitute the H in the alkyl group), but when X2 it is O, Y8 does not exist. Other relevant components can also be added as needed, such as pH buffers, foaming agents, preservatives, etc. The anti-tarnish effect is better when iodide ions are present. Some specific examples are shown in Table 2-44.
Table 2-44 Formulation Examples of Diketo Surfactants for Silver Tarnish Prevention
Komposisi Nomor 1 Nomor 2 Nomor 3 Nomor 4 Nomor 5 Nomor 6 Nomor 7 Nomor 8
Chlorovanillic acid 10
Polyoxyethylene alkyl ether 0.5
Sodium dihydrogen phosphate 5
Polyethylene glycol 1
Tretinoin 5
Pyrazole chloride 5
Sodium bicarbonate 5
Protease 1
Potassium iodide 0.05
Tetrahydroxy-1,4-benzoquinone 0.5
2-Alkyl-N-carboxymethyl-N-hydroxymethylimidazoline 10
Thiourea 0.5
Glycerol 1
Sodium 3-ethyl-2-hydroxy-2-cyclopentane-1-carboxylate 0.05
Potassium alkyl sulfonate 5
Isocyanuron salt 5
N-Acylated amines 1
3-Hydroxy-2-methyl-4-pyrone 20
Asam sitrat 5
Sodium benzoate 5
Menthol 0.1
Calcium rosmarinic acid 2
3-Methyl-1,2-Cyclopentanaminium 20
Polyoxyethylene castor oil 5
Steroidal Glycosides 1
3-Hydroxy-1,2-dimethyl-4(1H)-pyridine 6
Mercaptoalanine 2
Glucoamylase 5
Sorbitol 1
2,5-Dihydroxy-1,4-benzoquinone 10
Alkyl benzyl ammonium chloride 30
Potassium sodium tartrate 5
Papain 1
It has been confirmed through experiments that all solutions have anti-tarnish and anti-corrosion effects on silver plating and its alloys.

Section II Electroless Silver Plating

Because silver has low resistivity and is much cheaper than other precious metals, silver plating is widely used in the electronics field.

As a precious metal, silver has a more positive redox potential than other metals, allowing it to be displaced and deposited on metals such as copper, iron, and zinc, forming a silver plating layer on these metals. It will be mentioned later that this type of reaction is used on printed circuit boards to replace the copper with silver so that the copper pattern is covered by a layer of silver, thereby increasing solderability and reducing contact resistance. However, this displacement deposition generally results in a relatively thin plating layer, about 2μm or less. In contrast, the plating layer obtained through a reduction reaction can be somewhat thicker.

In the application of silver plating, the most famous should be the silver mirror reaction. The silver mirror reaction was developed by Drayton in 1830 and was applied to the mirror manufacturing industry. In addition, chemical silver plating (especially reduction silver plating) is widely used in electronics, thereby expanding the industrial applications of silver plating. Chemical silver plating can be applied not only to metals but also to non-metals.

1. Displacement of Silver Plating and its Applications

Displacement silver plating utilizes the potential difference between the base metal and silver.

The conductor patterns on printed circuit boards are usually made of copper, but during storage, before component mounting, an oxide film forms on the copper surface. This oxide film affects the solderability of the circuit board. High-end products or even Ni/Au, Ni/Pd, Ni/Pa/Au plating are generally used to enhance the brazing ability of copper circuits, which naturally increases the cost. However, Sn plating lacks sufficient rust resistance. Silver plating is close in price to Sn and not only prevents rust and is suitable for brazing but can also be used for metal wire connections, meaning silver can be displacement-plated on copper circuits. However, the thickness must be increased to compensate if silver is plated directly on copper due to uneven plating. This makes the plating fail the tape test, with plating peeling off easily, especially after storage. However, this problem can be solved by two-step plating. The method is to first plate a layer of metal, which is more expensive than copper, on the copper, then displacement plate silver. The first metal layer can be Pd or Ag. The thickness is so thin, on the order of nanometers (i.e., several nanometers thick), that the presence of the plating cannot be recognized with the naked eye. The displacement reaction is:

Cu + Ag+ → Cu+ + Ag

The silver displacement solution must also contain a complexing agent for monovalent copper to stabilize the displaced copper ions. When the first coating is displacement silver, its displacement rate must be much slower than that of the second Ag plating layer, equivalent to less than 15% of its speed. If it is too fast, it is easy to cause a decrease in coating adhesion, resulting in coating peeling during the tape test. The following is an example of silver plating.

When the first plating layer is Pd, the Pd plating solution is

PdSO4     50mg/L (accounted as Pd)

H2SO4       5%

Temperature            Room temperature

Time           About 30s

The composition of silver plating and its process conditions are shown in Table 2-45.
Table 2-45 Composition and Process of Displacement Silver Plating (first plating layer)
Komposisi dan kondisi proses Formulasi dan komponen Komposisi dan kondisi proses Formulasi dan komponen
Silver methanesulfonate (as Ag) 1g/L Lurotex A25 20mg/L
NaBr 320g/L pH 5.5
Diethylenetriamine pentylenephosphonic acid 30mL/L Suhu 50℃
Polyethylene glycol 400 80mL/L Time 5 min
2,2'-Bipyridine 90mg/L

After plating, the plated parts undergo heat treatment at 150℃ for 4 hours, followed by a wettability test, which is qualified.

When the first plating layer is Ag, the plating solution and its process are shown in Table 2-46.

Table 2-46 Composition and Process of Displacement Silver Plating (Second Coating)
Komposisi dan kondisi proses Formulasi dan komponen Komposisi dan kondisi proses Formulasi dan komponen
Silver methanesulfonate (as Ag) 1g/L Polyethylene glycol 400 80mL/L
NaBr 320g/L 2,2'-Bipyridine 90mg/L
Diethylenetriamine pentylenephosphonic acid 30mL/L pH 5.5

The plating solution for the first and second plating layers can have the same composition, but the temperature and immersion time differ. The conditions for the first plating layer are as follows: 25℃, 30s. The conditions for the second plating layer are as follows: 50℃, 6min. The resulting plating layers are uniform, silver bright, and have good brazing weldability.

Hutchinson et al. proposed a plating solution method using alkyl polyethylene glycol ether as a brightener, ethylenediamine, and 1-hydroxyethylene-1,1-diphosphonic acid as copper complexing agents, and the obtained plating layer can meet the soldering conditions of printed circuit boards.

ITO (a transparent indium tin oxide) is widely used in liquid and plasma crystal displays. As the size of liquid crystal displays and plasma displays has increased in recent years, the resistance of ITO itself has become relatively high. To solve this problem, a silver layer with lower conductivity can be added to the ITO. This cannot be implemented by silver electroplating directly because it is difficult to directly deposit catalytically active metals on ITO. Therefore, a layer of tin is first deposited on the ITO, followed by a catalytically active metal deposition, and finally, silver plating. The composition of the plating solution and process conditions for silver plating on ITO are shown in Table 2-47.

Table 2-47 Composition of the Plating Solution and Process Conditions for Silver Plating on ITO
Immersion Tin Liquid

SnCl2

HCl

70g/L

230mL/L

Activation Fluid AgNO3 10 gram/L
Silver plating solution

AgNO3

NH4OH

(NH4)2SO4

Co(SO4)2

Mg(OH)2

Ag thickness

Specific resistance

Specific resistance (250℃, 30min after treatment)

0. 03〜0. 08mol/L

7〜10mol/L

0. 3〜0. 8mol/L

0. 1〜0. 2mol/L

0. 01〜0. 05mol/L

2900〜3200Å

3〜3. 5μΩ• cm

1. 6〜2. 5μΩ• cm

Among them, Co(SO4)2 acts as a reducing agent, and its reaction is as follows:
Ag+ + Co2+ → Ag + Co3+
The purpose of adding Mg2+ is to prevent Ag agglomeration and precipitation, ensuring Ag deposition’s uniformity.

2. Reduction of Silver Plating and its Applications

The composition of the reduction silver plating solution is similar to that of general chemical plating, with the main components being: Ag salt, complexing agent, reducing agent, pH adjuster, stabilizer, etc. The reducing agents for silver include glucose, saccharin, glyoxal, ascorbic acid, gluconic acid, sorbitol, hydrazine, HCHO, KBH4, NaBH4, DMAB and others.

The reactions of some representative silver-reducing agents are as follows.

(1) HCHO (when using ammonia solution as a complexing agent)

2AgNO+ 2NH4OH → Ag2O + 2NH4NO3 + H2O

Ag2O + 4NH4OH → 2[Ag(NH3)2]OH + 3H2O

2[Ag(NH3)2]OH + HCHO → 2Ag + 4NH+ HCOOH + H2O

(2) Tartrate salts

4AgNO3 + 4NH3 + C4H4O6NaK + H2O → 4Ag + 4NH4NO3 + C3H2O6NaK + CO2

(3) Hydrazine

4[Ag(NH3)2]NO+ N2H4 → 4Ag + 4NH4NO3 + 4NH3 + N2

(4) Borohydride

N2H4BH3 + 3Ag+ + 4OH → 3Ag + N2H4 + B(OH)4+ 3/2H2

In addition, there have been attempts to use organic solvents to replace cyanide with non-cyanide silver plating. This plating solution can be used on non-conductive materials that are unstable or hydrophobic in aqueous solutions. The formula is shown in Table 2-48.
Table 2-48 Formulations Using Organic Solvents for Electroless Silver Plating
Bahan-bahan dan kondisi prosesnya Nomor 1 Nomor 2

Dimethyl sulfoxide/mL

Ethylene glycol/ml

Ethanol/mL

d-(+)Glucose/mL

Triethylamine/mL

Suhu/°C

Time/min

Plating materia

300

200

-

-

15

70

20

Al2O3 powder

200

-

300

5g

2. 5mL/min

60

10

Nylon cloth

Among them, diols and glucose are used as reducing agents. At the same time, since dimethyl sulfoxide has a slight reducing ability, the plating solution does not require aging treatment. The resulting plated parts have silver-like metallic luster.

Organic compounds containing two monothiol groups are used as complexing agents, with the structural formula as follows:

X—R1 —S—R2 —R3 —Y

In the formula, R1 and R2 are alkylene groups containing 1~5 carbon atoms; R3 are an alkylene group containing 2~8 carbon atoms X and Y can be carboxyl, sulfonic acid, amino, alkyl groups, etc.

The reducing agents include aldehydes, hydrazines, borohydride compounds, ascorbic acid, etc. Table 2-49 shows examples of the use of this series.

Table 2-49 Process Conditions of Silver Reduction Plating Solution Using Two Monothiol Organic Compounds as Complexing Agents
Komposisi dan kondisi prosesnya Nomor 1 Nomor 2 Nomor 3

Silver nitrate/(g/L)

1,2-Bis(2-carboxyethylthio)ethane/(g/L)

1,4-bis(2-carboxyethylthio)butane/(g/L)

1,2,2'-(Ethylthio)diethyl mercaptan/(g/L)

Hydrazine hydrate/(g/L)

Formalin/(g/L)

Sodium hypophosphite/(g/L)

pH (adjusted with NaOH)

Suhu/°C

0. 17

10

-

-

8

-

-

10

35

0. 31

-

15

-

-

4

-

11

50

0. 34

-

-

20

-

-

10

10. 5

50

The above plating solution can be used for silver plating on copper plates, alumina ceramic pieces, and epoxy resin (activation treatment must be performed in advance when plating on ceramics and resin), and a uniform plating layer can be obtained. After plating, if the plating solution is left at room temperature for 4 weeks and then used again, a good plating film can still be obtained, with no pH changes or precipitation observed.

Section III Analysis of Cyanide Silver Plating Solution

1. Analysis of Silver

See Table 2-50.
Table 2-50 Silver Ion Analysis Method for Silver Plating Solution
Operation sequence Notes and Instructions

(1) Take 5ml of plating solution into 300 beaker, add 20mL of sulfuric acid and 5mL of nitric acid while observing.

(2) Heat until white smoke is produced

(3) Add 100mL of water and 3mL of 10% ammonium iron sulfate.

(4)Titrate with 0.1mol/L potassium thiocyanate.

Calculation formula:

Ag(g/L) = mL × 2. 158× f

AgCN(g/L) = Ag(g/L) ×1. 2402

In the formula, mL——0. 1mol/L titer of potassium thiocyanate;

f——0. 1mol/L potassium thiocyanate solution coefficient

Due to the generation of toxic hydrogen cyanide gas, it is necessary to operate in a local ventilation area.

Change from brown smoke to white smoke

Titration endpoint: light red color

0. 1mol/L KCNS 1mL = 0. 01079g Ag

2. Methods for Analyzing Free Cyanide

See Table 2-51.
Table 2-51 Analytical Methods for Free Cyanide
Operation sequence Notes and Instructions

(1)Take 5ml of plating solution into 300m beaker, add water 50mL

(2)Add 10% potassium iodide solution 1~2mL

(3)Titrate with 0.1mol/1 silver nitrate solution

Calculation formula.

Free KCN (g/L) = mL×2.60×f

Free NaCN (g/L) = mL×1.96× f

In the formula, f - coefficient of 0.1mol/L silver nitrate solution

Titration endpoint: light red color

0. 1mol/L AgNO3 1mL = 0. 0130g KCN

= 0. 0098g NaCN

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